Industrial

Global Wire Bonder Equipment Market Industry: A Latest Research Report to Share Market Insights and Dynamics

Wire bonder equipment is the machinery used for making interconnects between an IC or any other semiconductor device at the time of packaging. This interconnection ensures the flow of electricity in the semiconductor device. The thin-wire used to make these connections are usually made of copper, gold, aluminum, or silver. Wire bonder equipment is part of the semiconductor assembly and packaging process.

According to the report, one of the major drivers for this market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is characterized by relationship-based sales. The selling price of such equipment is usually in the range of $100,000-$1,000,000. Therefore, manufacturers look to develop long-standing relations with customers buying their product offerings. The outlook of building such relations is to ensure repeat purchases by offering discounts and incentives for future orders. This is mostly practiced on those customers who account for around 5-10% of the equipment manufacturers sales.

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The global Wire Bonder Equipment market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.

This report focuses on Wire Bonder Equipment volume and value at global level, regional level and company level. From a global perspective, this report represents overall Wire Bonder Equipment market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.

Key companies profiled in Wire Bonder Equipment Market report are Kulicke& Soffa, Palomar Technologies, Besi, Dias Automation, F&K Delvotec Bondtechnik, Hesse, Hybond, Shinkawa Electric and more in term of company basic information, Product Introduction, Application, Specification, Production, Revenue, Price and Gross Margin (2014-2019), etc.

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Table of Content

1 Wire Bonder Equipment Market Overview

2 Global Wire Bonder Equipment Market Competition by Manufacturers

3 Global Wire Bonder Equipment Production Market Share by Regions

4 Global Wire Bonder Equipment Consumption by Regions

5 Global Wire Bonder Equipment Production, Revenue, Price Trend by Type

6 Global Wire Bonder Equipment Market Analysis by Applications

7 Company Profiles and Key Figures in Wire Bonder Equipment Business

8 Wire Bonder Equipment Manufacturing Cost Analysis

9 Marketing Channel, Distributors and Customers

10 Market Dynamics

11 Global Wire Bonder Equipment Market Forecast

12 Research Findings and Conclusion

13 Methodology and Data Source